The Plasma Science & Technology Division (PSTD) program highlights the latest advances in plasma science, ranging from fundamental studies of plasma physics and chemistry to plasma-matter interactions and new applications for etch processing. Our global community spans academia, national facilities, and industry and strives to engineer the future in plasma research applied to sustainable semiconductor processing, as well as atmospheric pressure plasmas and chemical and energy conversion, novel materials synthesis, and catalysis. Novel areas such as atomic-scale processing, advanced packaging including photonics, AR/VR, AI/ML, power and RF devices, patterning, isotropic etch, and thermal etch techniques are also of interest.
Areas of Interest: For AVS 72, the PSTD is seeking abstracts that fall within the following themes:
- Plasma Etching, Deposition, and Processing for Advanced Device Fabrication: State-of-the-art front (FEOL) and back (BEOL) end-of-line patterning and processing for logic devices, emerging memory applications, quantum devices, and photonics; advanced packaging, chiplets & heterogeneous integration.
- Plasma enhanced atomic layer processing: Area selective deposition, characterization and metrology to enable atomic scale processing, atomic layer process chemistry, surface reactions and atomic layer etching. Novel thin film deposition processes and material synthesis studies are also encouraged.
- Plasmas and Plasma-Surface Interactions – Experiment and Modeling: Fundamental understanding of plasma-surface interactions, modeling and simulation challenges associated with plasma-based materials synthesis, processing, and etching; kinetic, fluid, hybrid, and data-driven models; control; and experimental validation of simulations.
- Plasma Sources, Diagnostics, Sensing, and Control: Novel plasma generation schemes and (ion beam) sources at low and high pressures; plasma diagnostics; pulsed plasmas and waveform shaping; process sensing and control schemes.
- Plasmas for Chemical, Energy, and Sustainable Applications: Emerging venues where plasmas provide unique advantages in chemical, environmental, energy, and biological applications. New plasma processes for sustainable technologies (chemical conversion, batteries, fuel cells, electrochemistry, photovoltaics, low GWP gases) and atmospheric pressure processing. Making today’s processes more energy efficient and environmentally friendly.
PS1: Atomic Layer Processes (ALP): Deposition (ALD), Etching (ALE), and Area Selective Patterning Oral Session
Invited Speakers:
- Masanaga Fukasawa, AIST, Japan, “Atomic Layer Etching for Advanced Logic Devices”
- Dren Qerimi, University of Illinois at Urbana-Champaign, “Young Investigator Awardee Talk”
- Yevgeny Raitses, Princeton Plasma Physics Laboratory, “Low Temperature Magnetized Plasmas for Processing of 2D Materials.”
- Steve Shannon, North Carolina State University, “Plasma Prize Talk: Controlling Ion Energies Through Sheath Modulation”
- Kazunori Shinoda, Hitachi High Technologies, Japan, “Selective Isotropic Atomic Layer Etching via Thermal-Cyclic Processing: Broad Material Capabilities with a Focus on Work Function Metal Films”
PS2: Plasmas for Advanced Logic and Advanced Memories Oral Session
Invited Speakers:
- Scott Allen, IBM
- Sung-il Cho, Samsung Electronics Co., Inc., Republic of Korea
- Hiroyuki Fukumizu, KIOXIA, Japan, “Investigation of Surface Reactions of SiO2 and SiN Films Under Cryogenic Etching Process via in-Line/Situ Analysis”
- Mark Kawaguchi, Lam Research Corporation
- Miyako Matsui, Hitachi, Ltd., Japan, “Roughness-generation Mechanism in Ru Etching using Cl2/O2-based Plasma for Advanced Interconnect.”
- Arame Thiam, Tokyo Electron Europe, Belgium
PS3: Plasmas for Advanced Packing Oral Session
Invited Speakers:
- Violeta Georgieva, IMEC, Belgium, “Challenges in Plasma Etching for 3D Interconnect Technology.”
- Brittany Hedrick, Tokyo Electron America, USA, “Etch Opportunities in Advanced Packaging and Optical Photonics”
PS4: Plasma Catalysis and Sustainability Oral Session
Invited Speakers:
- Kurtis Fairley, Edward vacuum
- Tomohiro Nozaki, Institute of Science, Tokyo, Japan, “Electrifying C1 Chemistry via Nonthermal Plasma Catalysis”
PS5: Plasma-Surface Interactions Oral Session
Invited Speakers:
- Shih-Nan Hsiao, Nagoya University, Japan, “Plasma-Surface Reactions in Si-Based Dielectric Materials During HF-Based Cryogenic Etching””
PS6: Plasma Sources and Diagnostics and Modeling – AI/ML Oral Session
Invited Speakers:
- Fatima Jenina Arellano, ULVAC, Inc., Japan, “Machine Learning-Assisted Plasma Process Monitoring and Optimization””
- James Ellis, Oxford Instruments Plasma Technology, UK, “Plasma Diagnostics for Industry: Restrictions, Reluctance, and Reward””
- Dawei Gao, Zhejiang ICsprout Semiconductor, China
- Sijun Kim, Laboratoire de Physique des Plasmas (LPP), France
PS7: Plasma for Coating and Thin Films Oral Session
Invited Speakers:
- Jean Philippe Soulié, IMEC Belgium, “Epitaxial Conductors to Replace Cu in Advanced Interconnect Metallization”
- Luke Walker, Hereaus
PS8: Plasma Science and Technology Poster Session