Abstract Submission Deadline: May 18
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  • Call for Abstracts
    • Call for Abstracts (PDF)
    • Technical Sessions
      • Divisions & Groups
        • 2D Materials (2D)
        • Advanced Surface Engineering (SE)
        • Applied Surface Science (AS)
        • Biomaterial Interfaces (BI)
        • Electronic Materials and Photonics (EM)
        • Magnetic Interfaces and Nanostructures (MI)
        • Manufacturing Science and Technology (MS)
        • Nanoscale Science and Technology (NS)
        • Plasma Science & Technology (PS)
        • Spectroscopic Ellipsometry (EL)
        • Surface Science (SS)
        • Thin Film (TF)
        • Vacuum Technology (VT)
      • Focus Topics
        • Actinides and Rare Earths (AC)
        • Advanced Packaging (PK)
        • Advances in EUV Lithography (EUV)
        • AI/ML Autonomous Experimentation for Thin Films Processing (AIML)
        • Chemical Analysis and Imaging of Interfaces (CA)
        • Light Sources Enabled Science (LS)
        • Materials and Innovations for Fusion Energy (FUS)
        • Multifunctional and Hybrid Microsystems (MC)
        • Quantum Science & Technology (QS)
        • The Future of Temperature Sensing (TS)
      • Mini-Symposia
        • Advanced Microelectronic Materials and Devices (AM)
        • Atomic Scale Processing (AP)
        • Advances in Battery Engineering, Interface Design, and Characterization (BT)
    • Special Sessions
      • Plenary Lecture
      • Special Symposium: From Ionic Crystals to Ionic Conductivity: A Special Celebration of Gary W. Rubloff’s 50+ Years in Science (GWR)
      • AVS Quantum Science Workshop
      • Biomaterials Plenary (BP)
      • Nanoscale Science and Technology Plenary (NSP)
      • Undergraduate Posters (UN)
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    • Exhibit & Sponsor Form (Online)
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Overview

Join Us at the Premier Symposium for Materials, Processing, Interfaces, and Devices!

The AVS International Symposium and Exhibition provides THE platform for discussing state-of-the-art advances in atomic-scale processing, characterization, measurement, and simulation of materials, surfaces, interfaces, and devices.

From fundamental science to manufacturing, this weeklong Symposium fosters a multidisciplinary environment where participants from industry, government labs, and academia can collaborate and explore research in vacuum technology, thin films, plasma science, microelectronic devices, quantum computing, 2D materials, nanostructures, biomaterials, surface and interfacial phenomena–and much more.

An extensive Exhibition of related equipment, tools, materials, supplies, chemicals, services, consulting, technical literature, and new technologies are also showcased throughout the week.

Why Attend?

Exhibit @ AVS72

The AVS International Symposium and Exhibition is one of the largest in the world and provides an excellent opportunity for AVS attendees and members to view the latest and greatest cutting-edge products and services offered by over 200 participating companies to the research and manufacturing communities associated with vacuum science and technology.

 Learn More

Abstract Submission

Abstract Submission Deadline:
May 18, 2026

SUBMIT ABSTRACT

Program Chair

Mark Losego
Georgia Tech, USA

Program Vice Chair

Angélique Raley
TEL Technology Center America, LLC

Plenary Speaker

Akihisa Sekiguchi, Ph.D. 
Corporate Fellow, GM
Corporate Innovation Division
Tokyo Electron Limited

“Vacuum Science and Technology:
Enabling the Next Era of Industrial Transformation.”

Topics

    • 2D Materials
    • Actinides and Rare Earths
    • Advanced Microelectronic Materials
    • Advanced Packaging
    • Advanced Surface Engineering
    • Advances in Battery Engineering, Interface Design, and Characterization
    • Advances in EUV Lithography
    • AI/ML/Autonomous Experimentation for Thin Films Processing
    • Applied Surface Science
    • Atomic Scale Processing
  • AVS Quantum Science Workshop
  • Biomaterial Interfaces
  • Biomaterials Plenary
  • Chemical Analysis and Imaging of Interfaces
  • Electronic Materials and Photonics
  • From Ionic Crystals to Ionic Conductivity: An Iconic Celebration of Gary W. Rubloff’s 50+ Years in Science
  • Light Source Enabled Science
  • Magnetic Interfaces and Nanostructures
  • Manufacturing Science & Technology
  • Materials and Innovations for Fusion Energy
  • Multifunctional and Hybrid Microsystems
  • Nanoscale Science & Technology
  • Nanoscale Science and Technology Plenary
  • Plasma Science and Technology
  • Quantum Science and Technology
  • Spectroscopic Ellipsometry
  • Surface Science
  • The Future of Temperature Sensing
  • Thin Films
  • Undergraduate Posters
  • Vacuum Technology

Key Dates

Major Awards Deadline:
March 31, 2026
Early Registration Deadline:
October 5, 2026
Student Awards Deadline:
May 18, 2026
Hotel Deadline:
TBA, 2026
Abstract Submission Deadline:
May 18, 2026

Future Meeting Dates

AVS 73 (2027):
October 24-29, 2027
Portland, Oregon
AVS 74 (2028):
TBA

Please be cautious of scammer e-mails that are being sent by third parties who claim to be representatives of the AVS (American Vacuum Society). The AVS 72 attendee list is not for sale. These marketing firms are not affiliated with AVS so please do not correspond with them. AVS 72 Housing should only be booked via the link provided at https://avs72.avs.org/. Housing will not open until September 2026.

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Key Dates

Major Awards Deadline:
March 31, 2026

Student Awards Deadline:
May 18, 2026

Abstract Submission Deadline:
May 18, 2026

Early Registration Deadline:
TBA, 2026

Hotel Deadline:
TBA, 2026

Contact

Yvonne Towse
Conference Administrator
125 Maiden Lane; Suite 15B
New York, N.Y. 10038
yvonne@avs.org

 

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