Advanced Packaging focuses on trends and initiatives shaping Advanced Packaging, the back-end portion of the semiconductor industry. During the session, we will cover how the industry is enabling chiplet-based and other Advanced Packaging solutions, reshoring of Advanced Packaging capabilities, and technical advancements in processes and materials for next-generation integration schemes.
PK-ThP: Advanced Packaging Poster Session
PK+MS-FrM: Advanced Packaging Oral Session
- Tanja Braun, Fraunhofer IZM, Germany, “Advanced Packaging Approaches for Chiplet Solutions”
- Michael Gleason, GreenSource Fabrication, “On-Shore Sustainable Organic IC Substrate (ICS) Fabrication”
- Jonas Wiedenmann, Heidelberg Instruments Mikrotechnik GmbH, Mittelgewannweg 27, 69123 Heidelberg, Germany, “Maskless Lithography for Wafer and Panel-Level Advanced Packaging: Enabling Adaptive Patterning Beyond Reticle Limits”