The TF Division program provides a week-long forum for academic, government, and industrial researchers and practitioners to share new advances in the processing, structure, properties, and applications of thin films. Topics span from the fundamental science of thin film processing and characterization to the scale-up and commercialization of thin film deposition equipment and devices. TF is particularly seeking abstracts that fall under five broad thematic areas:
- Atomic Scale Processing for Thin Film Formation and Patterning: These sessions will highlight current advances in atomic-scale processes including energy-enhanced atomic layer deposition (ALD), atomic layer etching (ALE), area-selective deposition (ASD), and integration of deposition with etching for patterning. These sessions will be integrated with the Atomic Scale Processing Mini-Symposium.
- Thin Film Processing for Microelectronics and Advanced Packaging: These sessions will gather experts from academia, government, and industry to explore current challenges and opportunities in thin film processing for microelectronics and advanced packaging. Discussions will cover chemical vapor deposition (CVD) and ALD processes for BEOL and packaging applications, along with recent developments in deposition processes for ferroelectrics and other functional materials.
- Vapor Synthesis of Hybrid, Organic, and Polymeric Materials (VSHOP): These sessions will coalesce experts in the vapor deposition of organic, polymeric, and organic-inorganic hybrid materials including 2D and 3D frameworks using processes like molecular layer deposition (MLD), initiated chemical vapor deposition (iCVD), vapor infiltration (VPI, SIS, and ALI) and other related techniques to discuss recent advances in processing science, structure-property relations, and material applications.
- Thin Films for Energy Applications: These sessions will address the use of thin film technologies for energy generation and storage (e.g., photovoltaics, capacitors, batteries, and fuel cells), sustainable systems (e.g., membranes for chemical separations), and extreme environment (e.g., space).
- Fundamentals of Thin Films and Thin Film Processing: These sessions will focus on the foundational aspects of nucleation and growth behaviors during thin film deposition, encompassing in-situ characterizations and multi-scale modeling.
- All graduate student participants are encouraged to submit an application for the Harper Award along with their abstract. Besides giving their session talk, the four Harper Award finalists will also compete in a special session giving interactive “TED-Style Talks” for the top prize.
Areas of Interest: TF is seeking abstracts in the following areas:
TF1: Atomic Scale Processing
Invited Speakers:
- Silvia Armini, IMEC, Belgium
- Yuri Barsukov, Lam Research, “Quantum Chemistry and Integrated Modeling for Understanding the Mechanisms of Selective and Cryogenic Atomic-Scale Etching”
- Michael Nolan, Tyndall National Institute, University College Cork, Ireland, “Multiscale Simulations for Atomic Scale Processing”
TF2: Thin Films for Microelectronics and Advanced Packaging
Invited Speakers:
- Ageeth Bol, University of Michigan, “Plasma Enhanced Atomic Layer Deposition of 2D Transition Metal Dichalcogenides for Nanoelectronics”
- Francois Fabreguette, Micron, “Area Selective Deposition Processing in the Memory Industry: How to Take Advantage of the High-Volume Manufacturing Environment”
- Asif Khan, Georgia Technical Institute
- Nian Sun, Northeastern University, “Integrated Magnetoacoustic Isolators with Giant Non-Reciprocity”
TF3: Vapor Synthesis of Hybrid, Organic, and Polymeric Materials
Invited Speakers:
- Jolien Dendooven, Ghent University, Belgium, “Selective Deposition and Infiltration of Ru and RuO2“
- Jeff Elam, Argonne National Lab
- Sung Gap Im, KAIST, Republic of Korea, “Vapor-Phase Deposited Functional Polymer Films and Their Device Applications”
- Jessie Mao, Oklahoma State University
- Sarah Park, POSTECH, Republic of Korea
TF4: Thin Films for Energy Applications
Invited Speakers:
- Dameron Arrelaine, ForgeNano, “Manufacturing-Scale Powder Atomic Layer Deposition for Battery Applications”
- Reeja Jayan, Carnegie Mellon University
- Marianna Kemell, University of Helsinki, Finland, “Atomic Layer Deposition of Metal Iodides”
- Paul Poodt, SparkNano, Netherlands, “Spatial ALD for Sustainable Energy Applications”
- Feng Yan, Arizona State University
TF5: Fundamentals of Thin Films and Thin Film Processing
Invited Speakers:
- Joseph Falson, Caltech
- Megan Holtz, Colorado School of Mines, “Mapping Nanoscale Polarity Using Scanning Nanobeam Electron Diffraction Techniques”
TF6: Thin Film Poster Session