Abstract Submission Deadline: May 18
x-twitter
#AVS72
AVS-72 Website logo 207x46 v2AVS-72 Website logo 207x46 v2
avslogo_blue_92x94avslogo_blue_92x94
  • Overview
    • Greetings & Introduction
    • Organizing Committee
      • Program Chairs and Committee Members
    • AVS Code of Conduct
    • Awards & Travel Grants
    • Manuscripts
    • Presentation Guidelines
    • Press Registration Form
    • Promote AVS 72: How to Help
      • Promotional Tips and Tools
      • AVS 72 PowerPoint Template (PPT)
      • AVS 72 Print Ad (PDF)
      • Why Attend Print Ad (PDF)
      • Why Attend Video
      • AVS 72 Banner Ad 300 x 250 (jpg)
      • AVS 72 Banner Ad 400 x 400 (png)
      • AVS 72 Banner Ad 600 x 90 (png)
      • AVS 72 Banner Ad 1200 x 675 (jpg)
      • AVS 72 Banner Ad Call 1200 x 675 (jpg)
      • AVS 72 Banner Ad Plenary 1200 x 675 (jpg)
      • AVS 72 PowerPoint Banner Ad 1920 x 190 (png)
      • AVS 72 Print Banner (jpg)
    • Photo Gallery
  • Call for Abstracts
    • Call for Abstracts (PDF)
    • Technical Sessions
      • Divisions & Groups
        • 2D Materials (2D)
        • Advanced Surface Engineering (SE)
        • Applied Surface Science (AS)
        • Biomaterial Interfaces (BI)
        • Electronic Materials and Photonics (EM)
        • Magnetic Interfaces and Nanostructures (MI)
        • Manufacturing Science and Technology (MS)
        • Nanoscale Science and Technology (NS)
        • Plasma Science & Technology (PS)
        • Spectroscopic Ellipsometry (EL)
        • Surface Science (SS)
        • Thin Film (TF)
        • Vacuum Technology (VT)
      • Focus Topics
        • Actinides and Rare Earths (AC)
        • Advanced Packaging (PK)
        • Advances in EUV Lithography (EUV)
        • AI/ML Autonomous Experimentation for Thin Films Processing (AIML)
        • Chemical Analysis and Imaging of Interfaces (CA)
        • Light Sources Enabled Science (LS)
        • Materials and Innovations for Fusion Energy (FUS)
        • Multifunctional and Hybrid Microsystems (MC)
        • Quantum Science & Technology (QS)
        • The Future of Temperature Sensing (TS)
      • Mini-Symposia
        • Advanced Microelectronic Materials and Devices (AM)
        • Atomic Scale Processing (AP)
        • Advances in Battery Engineering, Interface Design, and Characterization (BT)
    • Special Sessions
      • Plenary Lecture
      • Special Symposium: From Ionic Crystals to Ionic Conductivity: A Special Celebration of Gary W. Rubloff’s 50+ Years in Science (GWR)
      • AVS Quantum Science Workshop
      • Biomaterials Plenary (BP)
      • Nanoscale Science and Technology Plenary (NSP)
      • Undergraduate Posters (UN)
    • Submission Guidelines
    • Submit Abstract
    • Copyright Agreement
  • Exhibit
    • Exhibit Information & Opportunities
    • Exhibit & Sponsor Form (Online)
  • Sponsors
    • Major and General Sponsors
    • Division, Group, and Focus Topic Sponsors
    • Sponsorship Opportunities

Plenary Lecture

Home Plenary Lecture

Monday, November 9, 2026 – 8:30 AM
David L. Lawrence Convention Center

Biography

Dr. Akihisa (Aki) Sekiguchi currently serves as a Fellow of Tokyo Electron Limited`s Corporate Innovation Division.  Aki is responsible for planning and executing the worldwide alliance strategy for the division, including programs related to AI, quantum computing, and advanced CMOS logic development.

He is currently on SEMI`s Board of Industry Leaders and is a member of the CTO Forum representing TEL.

In previous roles, he has led Corporate Marketing and Corporate Technology Development at TEL as the VP and GM.

Prior to joining TEL in 2007, he worked for IBM Microelectronics Division for 17 years.  As part of the Semiconductor Research and Development Center, he worked on the development of FEOL, MOL, and BEOL process and equipment that enabled IBM`s DRAM and SOI-based logic technologies.  During his last three years with IBM, he was responsible for process technology transfer from IBM to Sony (used in PlayStation 3).

Aki earned his Ph.D. in Applied Physics from Columbia University, M. Eng. and B.S. in Engineering Physics from Cornell University, and an MBA in Finance from the Stern School of Business (New York University) while working for IBM.  His doctoral thesis was on experimental plasma physics for thermonuclear fusion.

Follow Us

Posts by AVS_Members

Key Dates

Major Awards Deadline:
March 31, 2026

Student Awards Deadline:
May 18, 2026

Abstract Submission Deadline:
May 18, 2026

Early Registration Deadline:
TBA, 2026

Hotel Deadline:
TBA, 2026

Contact

Yvonne Towse
Conference Administrator
125 Maiden Lane; Suite 15B
New York, N.Y. 10038
yvonne@avs.org

 

OverviewCall for AbstractsExhibitSponsors
© 2026 AVS. All Rights Reserved.