Abstract Submission Deadline: May 18
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Division: Thin Film (TF)

Home Division: Thin Film (TF)

The Thin Film Division program provides a week-long forum for academic, government, and industrial researchers and practitioners to share new advances in the processing, structure, properties, and applications of thin films. Topics span from the fundamental science of thin film processing and characterization to the scale-up and commercialization of thin film deposition equipment and devices. TF is particularly seeking abstracts that fall under five broad thematic areas:

  • Atomic Scale Processing for Thin Film Formation and Patterning: These sessions will highlight current advances in atomic-scale processes including energy-enhanced atomic layer deposition (ALD), atomic layer etching (ALE), area-selective deposition (ASD), and integration of deposition with etching for patterning. These sessions will be integrated with the Atomic Scale Processing Mini-Symposium.
  • Thin Film Processing for Microelectronics and Advanced Packaging: These sessions will gather experts from academia, government, and industry to explore current challenges and opportunities in thin film processing for microelectronics and advanced packaging. Discussions will cover chemical vapor deposition (CVD) and ALD processes for BEOL and packaging applications, along with recent developments in deposition processes for ferroelectrics and other functional materials.
  • Vapor Synthesis of Hybrid, Organic, and Polymeric Materials (VSHOP): These sessions will coalesce experts in the vapor deposition of organic, polymeric, and organic-inorganic hybrid materials, including 2D and 3D frameworks using processes like molecular layer deposition (MLD), initiated chemical vapor deposition (iCVD), vapor infiltration (VPI, SIS, and ALI), and other related techniques to discuss recent advances in processing science, structure-property relations, and material applications.
  • Thin Films for Energy Applications: These sessions will address the use of thin film technologies for energy generation and storage (e.g., photovoltaics, capacitors, batteries, and fuel cells), sustainable systems (e.g., membranes for chemical separations), and extreme environments (e.g., space).
  • Fundamentals of Thin Films and Thin Film Processing: These sessions will focus on the foundational aspects of nucleation and growth behaviors during thin film deposition, encompassing in-situ characterizations and multi-scale modeling.
  • All graduate student participants are encouraged to submit an application for the Harper Award along with their abstract. Besides giving their session talk, the four Harper Award finalists will also compete in a special session giving interactive “TED-Style Talks” for the top prize.

Areas of Interest: TF is seeking abstracts in the following areas:

TF1: Atomic Scale Processing: Thin Film Formation and Patterning Oral Session

Invited Speakers:

  • Parag Banerjee, University of Central Florida
  • Necmi Biyikli, University of Connecticut
  • Christophe Detavernier, University of Ghent, Belgium, “In Vacuo XPS as a Window Into ALD Growth”
  • Woo-Hee Kim, Hanyang University, Republic of Korea, “Atomic Layer Etching of Metals and Oxides for Advanced Angstrom-Scale Fabrication”
  • Miika Mattinen, University of Helsinki, Finland, “Chemistry (and Some Physics) of Atomic Layer Deposition of Two-Dimensional Metal Dichalcogenides”
  • Joachim Schnadt, Lund University, Sweden, “Understanding the Chemical Reaction Mechanisms of Oxide, Nitride and Metal ALD: Insights from Operando X-Ray Photoelectron Spectroscopy”
  • Angel Yanguas-Gil, Argonne National Laboratory

TF2: Thin Films for Microelectronics Oral Session

Invited Speakers:

  • Zsofia Baji, HUN-REN Centre for Energy Research, Hungary, “ When Growth Has Not Yet Begun: Nucleation and Interface Control in Atomic Layer Deposition”
  • Chris Hinkle, University of Notre Dame
  • Andrew Meng, University of Missouri
  • Shivani Srivastava, Micron Technology, “Memory Centric Ai and the Role of Advanced Materials in Future Microelectronics”

TF3: Vapor Synthesis of Hybrid, Organic, and Polymeric Materials (VSHOP) Oral Session

Invited Speakers:

  • Sumit Agarwal, Colorado School of Mines
  • Jeffrey Long, Naval Research Laboratory
  • Stefan Schröder, Kiel University, Germany, “Designing Functional Polymer Thin Films via Initiated Chemical Vapor Deposition”
  • Tamar Segel Peretz, Technion Israel Institute of Technology, Israel
  • Michael Tsapatsis, Johns Hopkins University

TF4: Thin Films for Energy Technology Oral Session

Invited Speakers:

  • Zahra Fakhraai, University of Pennsylvania
  • Caroline Sutter-Fella, Lawrence Berkeley National Laboratory

TF5: Thin Films for Batteries Oral Session

Invited Speakers:

  • Paul Braun, University of Illinois at Urbana-Champaign, “Plasma Modification of Li-Ion Battery Cathodes for High Voltage Cycling”
  • Neil Dasgupta, University of Michigan
  • Chuan-Fu Lin, Catholic University of America, “Understanding the Electrically-Limited Reaction Kinetics for Conversion Electrodes Using Lateral Thin Film Platforms’
  • Andrew Westover, Oak Ridge National Laboratory, “Thin Li Metal Films For Advanced Li Metal Batteries”

TF6: Far from Equilibrium Thin Films and Processes Oral Session 

Invited Speakers:

  • Lucas Caretta, Brown University, “Designing Topology, Spin-Split Magnetism, and High-Speed Dynamics in Ultrathin Multiferroics”
  • Tina Rost, Virginia Tech
  • Zac Ward, Oak Ridge National Laboratory, “Automating Entropy-Assisted Synthesis”

TF7: Fundamentals of Thin Films and Thin Film Processing Oral Session

TF8: Thin Film Poster Session

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May 18, 2026

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Key Dates

Major Awards Deadline:
March 31, 2026

Student Awards Deadline:
May 18, 2026

Abstract Submission Deadline:
May 18, 2026

Early Registration Deadline:
TBA, 2026

Hotel Deadline:
TBA, 2026

Contact

Yvonne Towse
Conference Administrator
125 Maiden Lane; Suite 15B
New York, N.Y. 10038
yvonne@avs.org

 

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