Much like the semiconductor industry, most of the advanced packaging industry migrated offshore over the past 15-20 years. As a result, Advanced Packaging is listed in the CHIPS and Science Act as one of the key areas that need to be reshored along with device manufacturing. Investments are already being made to that end. In parallel, the boundaries between device manufacturing and device packaging as separate foundries and production lines have blurred, with many device manufacturers (e.g., TSMC) becoming more vertically integrated by doing portions of advanced packaging processes internally (e.g., wafer-level packaging or wafer bumping). Similarly, the substrate manufacturers and packaging houses continue to shrink interconnect dimensions in their products and services, encroaching on dimensions typically associated with frontend foundries. This focus topic session will bring invited speakers from around the advanced packaging industry to highlight what is being done today and where the industry is headed, along with ongoing research in substrates, interconnects, wafer processes, and assembly processes enabling the next-generation of advanced packaging solutions.
Areas of Interest: This focus topic session will bring invited speakers from around the advanced packaging industry to highlight capabilities, materials, substrates, interconnects, wafer and assembly processes, and metrology/test approaches, enabling the next-generation of advanced packaging solutions, and is seeking abstracts in the following areas:
- Wafer-level Packaging/Wafer Bumping
- Wafer Finishing/Wafer Preparation
- TSV/TGV
- Heterogeneous Integration
- Advanced Packaging Facilities and Capabilities
- Substrates for Advanced Packaging
- Manufacturing tools and materials for advanced packaging
- Advanced Packaging Metrology and Reliability Testing
PK1: Advanced Packaging Oral Session
Invited Speakers:
- Muhannad Bakir, Ga Tech Packaging Research Center
- Eric Beyne, IMEC, Belgium
- Tanja Braun, Fraunhofer IZM
- Mike Gleason, GreenSource Fabrication
- Greg Moore, Heidelberg Instruments
- S.V. Sreenivasan, NGMM UT/TIE
PK2: Advanced Packaging Poster Session