Abstract Submission Deadline: May 18
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        • The Future of Temperature Sensing (TS)
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Greetings & Introduction

Home Greetings & Introduction

We are delighted to invite you to submit an abstract for the AVS 72nd International Symposium & Exhibition, scheduled to be held at the David L. Lawrence Convention Center in Pittsburgh, PA, November 8-13, 2026.
The AVS Symposium is the premier venue for presenting and discussing interdisciplinary science and technology related to materials, processing, surfaces, interfaces, and devices, serving attendees from industry, government labs, and academia.

The AVS symposium cultivates a dynamic environment that transcends traditional disciplinary boundaries. From fundamental science to manufacturing, this weeklong symposium fosters a multidisciplinary atmosphere where participants from industry, government labs, and academia collaborate and explore research in vacuum technology, thin films, plasma science, microelectronic devices, quantum computing, 2D materials, nanostructures, biomaterials, surface phenomena, and much more!

We are delighted to announce that this year’s plenary speaker is Dr. Akihisa (Aki) Sekiguchi, Fellow of Tokyo Electron Limited’s Corporate Innovation Division. He currently sits on SEMI’s Board of Industry Leaders and the CTO Forum. Dr. Sekiguchi sets TEL’s strategy for corporate innovation, including in AI, quantum computing, and advanced CMOS logic development. His presentation will set the stage for the conference, overviewing the current semiconductor technology roadmap and highlighting where the research and discoveries being discussed at the AVS Symposium can help accelerate solutions for today’s most critical challenges.

Over 25 AVS Divisions, Technical Groups, Focus Topics, and Mini-Symposia are soliciting abstracts for AVS 72. Take a moment to review the list below of diverse session themes to which you can submit your oral or poster abstract. When submitting to your chosen topic, ensure you select either the oral or poster session. The program committee will thoroughly review abstracts to make the most appropriate scheduling decisions as they build their sessions.

  • 2D Materials (2D)
  • Actinides and Rare Earths (AC)
  • Advanced Microelectronic Materials (AM)
  • Advanced Packaging (PK)
  • Advanced Surface Engineering (SE)
  • Advances in Battery Engineering, Interface Design, and Characterization (BT)
  • Advances in EUV Lithography (EUV)
  • AI/ML for Scientific Discovery (AIML)
  • Applied Surface Science (AS)
  • Atomic Scale Processing (AP)
  • Biomaterials Interfaces (BI) & Plenary Session (BP)
  • Chemical Analysis & Imaging of Interfaces (CA)
  • Electronic Materials and Photonics (EM)
  • From Ionic Crystals to Ionic Conductivity: An Iconic Celebration of Gray W. Rubloff’s 50+ Years in Science (GWR)
  • Light Sources Enabled Science (LS)
  • Magnetic Interfaces and Nanostructures (MI)
  • Manufacturing Science and Technology (MS)
  • Materials and Innovations for Fusion Energy (FUS)
  • Multifunctional and Hybrid Microsystems (MC)
  • Nanoscale Science (NS) and Technology and Nanoscale Plenary Session (NSP)
  • Plasma Science and Technology (PS)
  • Quantum Science and Technology (QS)
  • Spectroscopic Ellipsometry (EL)
  • Surface Science (SS)
  • The Future of Temperature Sensing (TS)
  • Thin Films (TF)
  • Undergraduate Poster Session (UN)
  • Vacuum Technology (VT)
  • AVS Quantum Science Workshop (AQS All-Invited Session)

We are confident that you will find many topics of interest and that you will enjoy the technical discussions and camaraderie at both the oral and poster sessions. Poster presentations are an excellent way to promote your work and engage in one-on-one interactions with many scientists and engineers in a relaxed environment. Please note that for AVS 72, you are allowed to present one oral abstract and one poster abstract, so please consider submitting both!

AVS 72 will also feature a special poster session to highlight undergraduate research, with prizes for the top presentations. Opportunities to apply for travel grants, as well as student, early career, and professional awards, are also available!

In addition to a vibrant technical program, there will also be an extensive equipment and vendor exhibition, short courses, and numerous networking, career advancement, and recruitment events for both those launching their careers and established researchers.

If you are new to the AVS community, WELCOME! We are confident that you will find the symposium to be a great place to meet new colleagues and friends with whom to share ideas for years to come. We encourage you to participate in this year’s Symposium by submitting an abstract before the deadline of Monday, May 18, 2026.

We eagerly anticipate your valuable contribution to the AVS 72nd International Symposium & Exhibition and look forward to seeing you in Pittsburgh!

Mark Losego                                                            Angélique Raley
Georgia Tech                                                            TEL Technology Center, America LLC
AVS 72 Program Chair                                             AVS 72 Program Vice-Chair

Program Chair

Mark Losego
Georgia Tech

Program Vice-Chair

Angélique Raley
TEL Technology Center, America LLC

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Key Dates

Major Awards Deadline:
March 31, 2026

Student Awards Deadline:
May 18, 2026

Abstract Submission Deadline:
May 18, 2026

Early Registration Deadline:
TBA, 2026

Hotel Deadline:
TBA, 2026

Contact

Yvonne Towse
Conference Administrator
125 Maiden Lane; Suite 15B
New York, N.Y. 10038
yvonne@avs.org

 

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